铋电镀液的配方研究

Study on the formula of the bismuth electroplating solution

摘要:

本文给出一种电镀铋的碱性镀液配方，并由正交试验得到其优方案为：硝酸铋60g/L，乙二胺四乙酸二钠(EDTA)90g/L，5-磺基水杨酸120g/L，酒石酸钾钠60g/L，氯化钾60g/L。分别讨论了铋含量对镀液镀速的影响，配位剂对阴极极化的影响。检测了铋镀层的表面粗糙度、微观形貌、附着强度等性能，结果表明：铋镀层表面均匀、平滑，结晶细致无裂纹，附着强度好，色泽光亮。

Abstract:

The alkaline electroplating bath formulation of bismuth was developed. The optimal composition formula was obtained by an orthogonal method as follows: bismuth nitrate 60g/L,disodium ethylene diamine tetraacetate(EDTA) 90g/L, 5-sulfosalicylic acid 120g/L, potassium sodium tartrate 60g/L, potassium chloride 60g/L. The influence of bismuth content on the rate of bismuth film and complexing agents on the impact of cathode polarization was studied. The surface roughness, microstructure and adhesion strength of bismuth film was detected. It was the result that the bismuth film has the features of fine and uniform grain, good smoothness, good adhesion and bright color.