PCB板化学镀用低浓度盐基胶体钯的研究

Study of Salt-based Colloid Palladium of Low Concentration In the PCB Electroless Plating

摘要:

论文通过研究PdCl2浓度、Sn/Pd（摩尔比）、反应温度、NaCl浓度对盐基胶体钯活性和稳定性的影响，确定了PCB板化学镀用的低浓度盐基胶体钯制备条件为PdCl2浓度0.4g/L、Sn/Pd为30、反应温度60±2℃、NaCl浓度160g/L。依据上述条件配置得到的活化液中，又分别添加了锡酸钠、尿素、香兰素和抗坏血酸四种添加剂，并分析了它们对活化液活性和稳定性的影响。结果发现尿素在提高活化液的活性和稳定性方面有很好的效果。尿素适宜最低浓度为10~15g/L。

Abstract:

By analyzing the effect of the PdCl2 concentration, Sn / Pd (molar ratio), reaction temperature, and NaCl concentration on the activity and stability of colloidal palladium, the optimal preparation conditions of salt-based colloid palladium of low concentration for the PCB electroless plating was obtained that the concentrations of PdCl2 and NaCl were 0.4g/L and 160g/L respectively, mole ration of Sn/ Pd was 30:1, reaction temperature was 60±2℃. Four different additives (tin sodium, urea, vanillin, and ascorbic acid) were added into the activation solution obtained according to the above conditions respectively. The effect of four different additives on the activity and stability of activation solution was investigated. The obtained results showed that the urea had a good effect on improving the activity and stability of the activation solution. The suitable minimum concentration of urea was 10 ~ 15g / L.