复合添加剂对次磷酸钠化学镀铜的影响

Effect of compound additives on Electroless Copper Plating Using Sodium Hypophosphite as Reducing Agent

摘要:

本文研究了在以次磷酸钠为还原剂的化学镀铜体系中， 2, 2’-联吡啶/亚铁氰化钾复合添加剂对化学镀铜的影响。采用电化学方法分析了无添加剂、单一添加剂和复合添加剂对次磷酸钠氧化电势和电流的影响，结果表明：2, 2’-联吡啶、亚铁氰化钾和2, 2’-联吡啶/亚铁氰化钾复合添加剂均使次磷酸钠氧化电势增加，氧化电流减小。扫描电子显微镜(SEM)、能量色散谱(EDS)、X射线衍射(XRD)、四探针测试法（SZT-90）等检测结果显示：较之单一添加剂，10mg/L 2, 2’-联吡啶/4mg/L亚铁氰化钾复合添加剂所得铜镀层纯度更高，w（Cu)= 96.27 %，外观更加光亮、致密和均匀，铜层表面平均电阻率也降低为0.0229 ?Ω? m。

Abstract:

Abstract: The electroless copper plating was studied in a bath consisting of sodium hypophosphite as reducing agent, 2, 2′-dipyridyl and K4Fe(CN)6 as additives. The effect of various additives on the deposits was systematically investigated in this paper. The electrochemical analysis showed that oxide potential was increased by addition of 2, 2′-dipyridyl and K4Fe(CN)6 additives. On the contrary, the oxide potential was decreased. Furthermore, the deposits were characterized by scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), X-ray diffraction (XRD) and four-probe method. Compare with single additive, the compound additive (10 mg/L 2, 2′-dipyridyl and 4 mg/L) showed higher purity of deposit (w（Cu)= 96.27 %), brighter and more compact deposit surface. In addition, the surface resistivity of the deposits was as low as 0.0229 μΩ• m.