双酚F型环氧丙烯酸酯树脂及光敏树脂的制备

Preparation and Characterization of Bisphenol F Photosensitive Resin

摘要:

以双酚F环氧树脂和丙烯酸为原料，经过聚合反应得到双酚F环氧丙烯酸酯预聚物，然后按照70%︰26%︰4%的比例与稀释剂TPGDA和光引发剂BDK配制成双酚F型光敏树脂，将光敏树脂的收缩率和凝胶含量作为指标考察影响树脂性能的合成工艺。经正交实验得到的最佳合成条件为：四甲基氯化铵为催化剂，用量为原料总质量的1.0%；对苯二酚为阻聚剂，用量为原料总质量的0.1%；反应温度为100℃；m(环氧树脂) ︰m(丙烯酸)=1︰0.8；反应时间4h。结果表明：利用最佳条件下得到的双酚F型光敏树脂收缩率为5.05%，凝胶含量为92.25%，相比于双酚A型环氧树脂收缩率降低30%，凝胶含量增加3%，对紫外光的灵敏性和吸收能力都相对增加，可以用于3D打印。

Abstract:

In this work, Bisphenol F epoxy acrylate prepolymer was prepared by using Bisphenol F epoxy resin and acrylic acid as raw materials, followed by mixing with diluent TPGDA and photoinitator BDK at the ratio of 70%︰26%︰4% to produce photosensitive bisphenol F resin. Its Shrinkage ratio and gel content were studied to for the optimum synthesis process. The orthogonal experiment results showed that, at 100℃, with 1.0% tetramethyl ammonium chloride as the catalyst, 0.1% bisphenol as polymerization inhibitor and the mass ratio of 1:0.8 between epoxy resin and acrylic acid, bisphenol F photosensitive resin’s shrinkage ratio was 5.05% after 4 hours’ reaction, which was 30% lower than Bisphenol A epoxy resin. The gel content was 92.25%, which was 3% higher than Bisphenol A epoxy resin. Meanwhile, the sensitivity to UV light and sensitivity and absorption capacity to UV were also improved. It can be used for 3D printing.