水基石墨烯-铜复合导电浆料的制备及性能

Preparation and properties of water-based graphene- copper composite conductive paste

摘要:

摘要：为降低成本和改善环保性能，采用水基载体替代有机载体，以粒径为5μm和15μm的混合铜粉作为主导电相，添加少量石墨烯为导电增强相，按一定的质量配比制备水基石墨烯-铜复合导电浆料。用四探针测试仪、扫描电子显微镜（SEM）等分析测试手段研究水基载体对浆料性能的影响，分析其导电机理并建立导电相连接模型。结果表明：当去离子水：CMC：PEG：消泡剂的质量比为96.9：1.5：1.5：0.1条件下制备的水基载体性能较好，水基载体含量为30%时，制备的水基石墨烯-铜复合导电浆料具有优良的印刷性能，且电阻率较小，为1.65 mΩ?cm，添加石墨烯的水基复合浆料较纯铜浆料电阻率降低了95.1%，较有机载体制备的石墨烯-铜复合浆料电阻率降低了75.78%。制得的导电膜更平坦、致密，导电相间的接触更紧密，大量的石墨烯在铜粉间隙之间或横向搭接，或径向填充，与铜粉形成并联或串联的导电通道，形成致密的导电网络，从而改善复合浆料的导电性能。

Abstract:

Abstract: To reduce costs and improve environmental performance, water-based carrier was used to replace organic carrier. The copper powders mixed with particle diameters of 5 μm and 15 μm were used as main conductive phase, and a small amount of graphene is added as conductive reinforcement phase. The water-based graphene-copper composite conductive paste was prepared according to a certain mass ratio. The effects of water-based carrier on paste performance were studied by four-probe tester and scanning electron microscope (SEM), and the conductive connection model was established by analysing for electric conduction mechanism. The results show that: when the mass ratio of deionized water: cmc: peg: defoamer is 96.9:1.5:1.5:0.1, the water-based carrier has better performance. When the water-based carrier content is 30%, the prepared water-based graphene-copper composite conductive paste has excellent printing performance and a small electrical resistivity of 1.65 mΩ?cm. The resistivity of water-based composite paste with graphene is 95.1% lower than that of copper paste and 75.78% lower than that of graphene-copper composite paste prepared by organic carrier. The conductive film is flatter and denser, and the contact between conductive phases is closer. A large number of graphene overlaps or fills the gap between copper powders laterally or radially, forming conductive channels in parallel or in series with copper powders. A dense conductive network is formed and the conductivity of the composite pastes can be improved.