高性能聚酰亚胺电磁屏蔽材料的研究进展

Research progress of high-performance polyimide electromagnetic shielding composites

摘要:

电磁信号之间的干扰和混乱已成为当今5G无线通信的时代的首要挑战，研发有效屏蔽高低频电磁干扰的高性能电磁屏蔽材料已成为当前的研究热点。未来电磁屏蔽材料将朝着超薄、柔性化、轻质化、宽频高效吸收、耐高温、力学性能好等方向发展。聚酰亚胺（PI）因其具有质量轻、可柔化、机械性能好、热学稳定性好等特点，常被用作高性能电磁屏蔽复合材料的基体材料。该文介绍了PI电磁屏蔽材料的屏蔽机理，重点总结了其屏蔽性能的影响因素及研究进展，并阐述了高性能PI电磁屏蔽材料未来的发展趋势，为后续PI类电磁屏蔽材料的研究提供参考。

Abstract:

Interference and confusion between electromagnetic signals have become the primary challenge in the era of 5G wireless communication, and the development of high-performance electromagnetic shielding materials that effectively shield high and low frequency electromagnetic interference has become a hot topic in current research. In the future, electromagnetic shielding materials will develop towards ultra-thin, flexible, lightweight, broadband efficient absorption, high temperature resistance, and good mechanical properties. Polyimide (PI) is used as the matrix material of many advanced electromagnetic shielding composites because of its good mechanical properties, good thermal stability, light weight, and flexibility. Therefore, this paper introduces the shielding mechanism of PI electromagnetic shielding materials and summarizes the influencing factors and research progress of their shielding performance. Finally, the future development trend of high-performance PI electromagnetic shielding materials is described to provide reference for the subsequent research of PI electromagnetic shielding materials.