芯片制造用含氟电子特气的研究进展

Research progress of fluorine-containing electronic special gases for chip manufacturing

摘要:

该文对芯片制造用含氟电子特气的发展现状进行了介绍。目前，开发出的含氟电子特气包括传统含氟电子特气和新型含氟电子特气两类。其中，新型含氟电子特气环境性能优异，可在刻蚀和清洁领域实现对传统含氟电子特气的替代。该文总结了新型含氟电子特气的主要合成路线，并指出最佳的产业化路线。由于当前含氟电子特气的主要知识产权被国外发达国家所垄断，而且刻蚀和清洁工序分步操作，导致工序繁复且效率低下，难以满足高端芯片集成度和良品率等更高的精度需求。今后研究重点在于，开发满足国家重大战略需求的新一代含氟电子特气，具备刻蚀/清洁协同双功能，具有简化工序、提高效率、提升芯片制造良品率的优点，实现对当前刻蚀和清洁仅能分步操作的含氟电子特气的理想替代。

Abstract:

This paper introduces the development status of fluorine-containing electronic special gases for chip manufacturing. At present, fluorine-containing electronic special gas can be categorized as the traditional ones and new generations. Among them, the new generations have excellent environmental performance, which can replace the traditional ones in the field of etching and cleaning. In this paper, the main synthetic routes of the new products are summarized, and the best industrialization route is pointed out. At this stage, the main intellectual property rights of fluorine-containing electronic special gases are currently monopolized by foreign developed countries, and the processes are complex and inefficient due to the separate parts of etching and cleaning, making it difficult to meet higher precision needs such as high-end chip integration and yield rate. Therefore, future research should mainly focus on the development of new generations with the dual functions of etching/cleaning synergy, which can not only meet the major strategic needs of the country but also have the advantages of simplifying the process, improving efficiency and the chip manufacturing yield, as well as replacing the current ones that are only used in a step-by-step manner.